街机电玩消除游戏The Hestia offers exceptional treatment uniformity with throughput and low risk, enabled by a compact vacuum chamber design and a fully automated material handing system.
街机电玩消除游戏• Pre-wire bonding: Removal of metal oxides to ensure good bond strengths and yields.
街机电玩消除游戏• Pre-molding: Enhance surface energy to improve material adhesion and eliminate defects such as delamination and voids.
街机电玩消除游戏• Pre-underfill: Improve fluidity of underfill encapsulants and reduce voids.
街机电玩消除游戏• Descumming: Removal of residue photoresist from wafers.
街机电玩消除游戏• Surface roughening and etching: reduce surface stress for better surface adhesion.
街机电玩消除游戏• High efficiency compact vacuum chamber offers exceptional treatment uniformity.
街机电玩消除游戏• Strips are transferred from magazines to an intermediate loading tray before entering the chamber, reducing the risk of interruption caused by strip misalignment.
街机电玩消除游戏• PLC and IPC combination provides stringent process control with an intuitive graphical interface and real-time process representation.
街机电玩消除游戏• Engineered for maximum reliability and durability while offering easy access for maintenance.
|Enclosure||WxDxH||2020W*1250D*1610H mm( 含灯塔高2015mm)|
|Electrodes||Max Number||334W x 432Dmm|
|PF System||RF Power&Frequency||600W/13.56MHz|
|Gas Control||Number of MFCs||2 standard/ up to 4|
|Vacuum Pump||Pump||80m³/h Dry Pump|
|Dry Pump Purge N2 Flow||5-25L/min|
|Facility Reauirements||Power Supply||380V，25A，50Hz，3-Phase，5-Wire|
|Process Gas Fitting Size&Type||0.25 in.OD|
|Process Gas Purity|
CF4 = 99.97%; O2 = 99.996%; N2 = 99.99%;
Ar = 99.999%; Consult the gzxnx for the rest of the gas
|Process Gas Pressure||15-30 psig|
|Purge Gas Fitting Size&Type||0.25 in.OD|
|Purge Gas Purity||N2=99.99%|
|Purge Gas Pressure||15-30 psig|
|Pneumatic Valves Fitting Size&Type||外径8mm PU软管|
|Pneumatic Gas Specifications||CDA、60-90 psig|
|Exhaust Size & Type||KF40|
|Working Temperature||15-30 ℃|